Effect of structure on thermal behaviour of epoxy resins

被引:68
作者
Jain, P [1 ]
Choudhary, V [1 ]
Varma, IK [1 ]
机构
[1] Indian Inst Technol, Ctr Polymer Sci & Engn, New Delhi 110016, India
关键词
phosphorus containing epoxy resin; amide-acid amines; imide linkage; curing behaviour; thermal stability; char yield;
D O I
10.1016/S0014-3057(02)00191-X
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TA-P) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4'-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3',4,4'-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4'-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:181 / 187
页数:7
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