Microfabrication processes on cylindrical substrates - Part I: Material deposition and removal

被引：1

作者：

Snow, Sean

Jacobsen, Stephen C.

机构：

[1] Univ Utah, Dept Bioengn, Salt Lake City, UT 84108 USA

[2] Sarcos Res Corp, Salt Lake City, UT 84108 USA

来源：

MICROELECTRONIC ENGINEERING | 2006年 / 83卷 / 11-12期

关键词：

cylinders; dip-coating; etching; optical fibers; nonplanar; rods; sputtering;

D O I：

10.1016/j.mee.2006.06.003

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Cylindrical substrates offer a unique geometry for microfabrication processing. This paper describes methods for depositing and removing materials from cylinders ranging in diameter from 85 mu m to 3000 mu m. Rotary-sputtered thin films are shown to have predictable deposition rates and excellent longitudinal and radial uniformity. Dip-coated films suffer from low radial uniformity and must be individually characterized to predetermine the film thickness applied for a given withdrawal rate. Etch processes display predictable etch rates similar to those for planar substrates. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：2534 / 2542

页数：9

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