Electrical Characterization of Screen-Printed Circuits on the Fabric

被引:139
作者
Kim, Yongsang [1 ]
Kim, Hyejung [1 ]
Yoo, Hoi-Jun [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Elect Engn & Comp Sci, Div Elect Engn, Taejon 305701, South Korea
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2010年 / 33卷 / 01期
关键词
E-textile; fabric; electrical characterization of fabric; packaging; planar-fashionable circuit board (P-FCB); silk-screen printing; sputtering; transmission lines; wearable computing; TEXTILE; DESIGN;
D O I
10.1109/TADVP.2009.2034536
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Fabrication methods of planar printed circuits on fabrics are introduced and their electrical characteristics are measured and analyzed. Wet patterning method like screen printing as well as dry process of sputtering are used to fabricate the patterned film electrodes on various types of fabrics. The minimum width of the patterns is 0.2 mm for screen printing and 0.1 mm for gold sputtering, and the typical sheet resistance is 134 m Omega/square. Fabrication methods of capacitors of 1 pF-1 nF and inductors of 500 nH-1 mu H at 10 MHz on the fabrics are also introduced. Bonding and packaging of silicon chip directly on the fabric circuit board are proposed and their mechanical properties are investigated. The ac impedance of the transmission line is measured as 201-215 with <7.4% variation, and the time-domain reflectometry profile shows that the -3 dB frequency of the printed transmission line of 15 cm on the fabric is 80 MHz. A complete system composed of a fabric capacitor sensor input, a controller system-on-a-chip, and an LED array display is implemented on the fabric and its operation is demonstrated successfully.
引用
收藏
页码:196 / 205
页数:10
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