Rigorous diffraction analysis for future mask technology

被引:36
作者
Erdmann, A [1 ]
Friedrich, C [1 ]
机构
[1] Fraunhofer Inst Integrated Circuits, Device Technol Div IISB, D-91058 Erlangen, Germany
来源
OPTICAL MICROLITHOGRAPHY XIII, PTS 1 AND 2 | 2000年 / 4000卷
关键词
lithography simulation; mask topography; phase shift masks; phase defects;
D O I
10.1117/12.389060
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Advanced lithographic techniques such as phase shift masks (PSM) and optical proximity correction (OPC) result in a more complex mask design and technology. With shrinking feature sizes, the topography of the mask becomes more and more important. We compare diffraction spectra, aerial images and resist profiles, which result from rigorous simulations to such one which are obtained with the assumption of an infinitely thin mask (Kirchhoff approach). The rigorous simulations were performed with a time-domain finite-difference algorithm. Consequences with respect to process linearity, mask error factor, printability of small assist features in OPC and phase defects in PSM will be discussed.
引用
收藏
页码:684 / 694
页数:11
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