Thermal properties of electrodeposited bismuth telluride nanowires embedded in amorphous alumina

被引：76

作者：

Borca-Tasciuc, DA

Chen, G ^{[1
]}

Prieto, A

Martín-González, MS

Stacy, A

Sands, T

Ryan, MA

Fleurial, JP

机构：

[1] MIT, Dept Mech Engn, Cambridge, MA 02139 USA

[2] Univ Calif Los Angeles, Dept Mech & Aerosp Engn, Los Angeles, CA 90095 USA

[3] Univ Calif Berkeley, Dept Chem, Berkeley, CA 94720 USA

[4] Purdue Univ, Sch Mat Engn, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA

[5] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA

来源：

APPLIED PHYSICS LETTERS | 2004年 / 85卷 / 24期

关键词：

D O I：

10.1063/1.1834991

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Bismuth telluride nanowires are of interest for thermoelectric applications because of the predicted enhancement in the thermoelectric figure-of-merit in nanowire structures. In this letter, we carried out temperature-dependent thermal diffusivity characterization of a 40 nm diameter Bi2Te3 nanowires/alumina nanocomposite. Measured thermal diffusivity of the composite decreases from 9.2x10(-7) m(2) s(-1) at 150 K to 6.9x10(-7) m(2) s(-1) at 300 K and is lower than thermal diffusivity of unfilled alumina templates. Effective medium calculations indicate that the thermal conductivity along nanowires axis is at least an order of magnitude lower than thermal conductivity of the bulk bismuth telluride. (C) 2004 American Institute of Physics.

引用

页码：6001 / 6003

页数：3

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