Application of an intermetallic compound Ti5Si3 to functionally graded materials.

被引：13

作者：

Kirihara, S ^{[1
]}

Tomota, Y ^{[1
]}

Tsujimoto, T ^{[1
]}

机构：

[1] Ibaraki Univ, Fac Engn, Hitachi, Ibaraki 316, Japan

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1997年 / 240卷

关键词：

functionally graded material; Ti5Si3; Ti; microstructural control; bonding; coating; heat and oxidation resistance;

D O I：

10.1016/S0921-5093(97)00636-9

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Ti-Ti5Si3-functionally graded materials (FGMs) have successfully been fabricated by utilizing bonding through a eutectic reaction which occurs between Ti and Ti,Si,, where Ti,Si, was employed because of its high heat and oxidation resistance. The bonding by the eutectic reaction has been investigated to bond a plate of pure Ti and of Ti,Si, together. A compositionally and microstructurally graded region, where the volume fraction of Ti5Si3 changes continuously, has been obtained between these plates after bonding at 1613 K. Subsequently, a similar method has been utilized to make coating on Ti plates and semi-round rods through the eutectic reaction with Ti5Si3 powder. In this case, a similar compositionally and microstructurally graded region has been obtained. No macroscopic defects, including observable cracks, have been detected in these FGMs fabricated. (C) 1997 Elsevier Science S.A.

引用

页码：600 / 604

页数：5

共 5 条

[1] Fabrication of Ti/Ti5Si3 functionally graded material by eutectic bonding method [J].