A mode III crack in functionally graded piezoelectric materials

被引：76

作者：

Wang, BL ^{[1
]}

机构：

[1] City Univ Hong Kong, Dept Mfg Engn & Engn Management, Kowloon, Hong Kong, Peoples R China

[2] Harbin Inst Technol, Ctr Composite Mat, Harbin 150006, Peoples R China

来源：

MECHANICS RESEARCH COMMUNICATIONS | 2003年 / 30卷 / 02期

基金：

中国国家自然科学基金;

关键词：

functionally graded materials; piezoelectric materials; smart materials; fracture mechanics;

D O I：

10.1016/S0093-6413(02)00366-X

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

This paper considers the mode III crack problem in functionally graded piezoelectric materials. The mechanical and the electrical properties of the medium are considered for a class of functional forms for which the equilibrium equations have an analytical solution. The problem is solved by means of singular integral equation technique. Both a single crack and a series of collinear cracks are investigated. The results are plotted to show the effect of the material inhomogeneity on the stress and the electric displacement intensity factors. (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：151 / 159

页数：9

共 4 条

[1] Crack problems in FGM layers under thermal stresses [J].

Erdogan, F ;

Wu, BH .

JOURNAL OF THERMAL STRESSES, 1996, 19 (03) :237-265

[2] DIFFUSION-PROBLEMS IN BONDED NONHOMOGENEOUS MATERIALS WITH AN INTERFACE CUT [J].

ERDOGAN, F ;

OZTURK, M .

INTERNATIONAL JOURNAL OF ENGINEERING SCIENCE, 1992, 30 (10) :1507-1523

[3] Antiplane crack problem in functionally graded piezoelectric materials [J].

Li, C ;

Weng, GJ .

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2002, 69 (04) :481-488

[4] Thermally induced fracture of a smart functionally graded composite structure [J].

Wang, BL ;

Noda, N .

THEORETICAL AND APPLIED FRACTURE MECHANICS, 2001, 35 (02) :93-109

← 1 →