High solder joint reliability with lead free solders

被引：69

作者：

Amagai, M ^{[1
]}

Toyoda, Y ^{[1
]}

Tajima, T ^{[1
]}

机构：

[1] Texas Instruments Inc, SC Package Dev, Tsukuba Technol Ctr, Tsukuba, Ibaraki 3050841, Japan

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

lead free solder; nickel; phosphorus; copper; board level reliability; drop test; bend test; thermal cycling test;

D O I：

10.1109/ECTC.2003.1216296

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Recently, preventing environmental pollutions, lead-free (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. However, Sn-Ag-Cu alloys were not satisfied to meet sever customer requirements. At first, optimum silver wt% was investigated to get the balance of drop, thermal cycling, bend test performance and solder internal voids. Additives including Ni, Co, Au, P, Ga, Cu and Sb was subsequently studied while observing reliability performance. Based on the results of board level reliability tests, new lead free solder has been developed. This paper presents the optimum Ag and additives including in Sn-Ag-based solder alloys.

引用

页码：317 / 322

页数：6