Ionized sputter deposition using an extremely high plasma density pulsed magnetron discharge

被引:230
作者
Macák, K
Kouznetsov, V
Schneider, J
Helmersson, U [1 ]
Petrov, I
机构
[1] Linkoping Univ, Dept Phys, SE-58183 Linkoping, Sweden
[2] Univ Illinois, Dept Mat Sci, Urbana, IL 61801 USA
[3] Univ Illinois, Mat Res Lab, Urbana, IL 61801 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 2000年 / 18卷 / 04期
关键词
Electric discharges - Ionization of solids - Magnetron sputtering - Plasma applications - Plasma density - Thin films;
D O I
10.1116/1.582380
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Time resolved plasma probe measurements of a novel high power density pulsed plasma discharge are presented. Extreme peak power densities in the pulse ton the order of several kW cm(-2)) result in a very dense plasma with substrate ionic flux densities of up to 1 A cm-2 at source-to-substrate distances of several cm and at a pressure of 0.13 Pa (1 mTTorr). The pulse duration was similar to 100 mu s with a pulse repetition frequency of 50 Hz. The plasma consists of metallic and inert gas ions, as determined from time resolved Langmuir probe measurements and in situ optical emission spectroscopy data. It was found that the plasma composition at the beginning of the pulse was dominated by Ar ions. As time elapsed metal ions were detected and finally dominated the ion composition. The effect of the process parameters on the temporal development of the ionic fluxes is discussed. The ionized portion of the sputtered metal flux was found to have an average velocity of 2500 m s(-1) at 6 cm distance from the source, which conforms to the collisional cascade sputtering theory. The degree of ionization of the sputtered metal flux at a pressure of 0.13 Pa was found to be 40%+/-20% by comparing the total flux of deposited atoms with the charge measured for the metal ions in the pulse. (C) 2000 American Vacuum Society. [S0734-2101(00)03404-7].
引用
收藏
页码:1533 / 1537
页数:5
相关论文
共 14 条
[1]  
Glocker D., 1996, HDB THIN FILM PROCES
[2]   INFLUENCE OF AN EXTERNAL AXIAL MAGNETIC-FIELD ON THE PLASMA CHARACTERISTICS AND DEPOSITION CONDITIONS DURING DIRECT-CURRENT PLANAR MAGNETRON SPUTTERING [J].
IVANOV, I ;
KAZANSKY, P ;
HULTMAN, L ;
PETROV, I ;
SUNDGREN, JE .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (02) :314-320
[3]   A novel pulsed magnetron sputter technique utilizing very high target power densities [J].
Kouznetsov, V ;
Macák, K ;
Schneider, JM ;
Helmersson, U ;
Petrov, I .
SURFACE & COATINGS TECHNOLOGY, 1999, 122 (2-3) :290-293
[4]  
*MULT INSTR AB, 1999, MECH 7500 MAN
[5]   MASS AND ENERGY-RESOLVED DETECTION OF IONS AND NEUTRAL SPUTTERED SPECIES INCIDENT AT THE SUBSTRATE DURING REACTIVE MAGNETRON SPUTTERING OF TI IN MIXED AR+N2 MIXTURES [J].
PETROV, I ;
MYERS, A ;
GREENE, JE ;
ABELSON, JR .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1994, 12 (05) :2846-2854
[6]  
POSADOWSKI WM, 1999, VACUUM, V47, P307
[7]  
ROHDE SL, 1994, PHYSICS THIN FILMS
[8]   METAL-ION DEPOSITION FROM IONIZED MAGNETRON SPUTTERING DISCHARGE [J].
ROSSNAGEL, SM ;
HOPWOOD, J .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (01) :449-453
[9]   GAS-DENSITY REDUCTION EFFECTS IN MAGNETRONS [J].
ROSSNAGEL, SM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (01) :19-24
[10]   MAGNETRON SPUTTER-DEPOSITION WITH HIGH-LEVELS OF METAL IONIZATION [J].
ROSSNAGEL, SM ;
HOPWOOD, J .
APPLIED PHYSICS LETTERS, 1993, 63 (24) :3285-3287