Tensile properties of in situ consolidated nanocrystalline Cu

被引:433
作者
Cheng, S
Ma, E [1 ]
Wang, YM
Kecskes, LJ
Youssef, KM
Koch, CC
Trociewitz, UP
Han, K
机构
[1] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA
[2] Lawrence Livermore Natl Lab, Chem & Mat Sci Directorate, Livermore, CA 94550 USA
[3] US Army Res Lab, Weapons & Mat Res Directorate, Aberdeen Proving Ground, MD 21005 USA
[4] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
[5] Natl High Magnet Field Lab, Tallahassee, FL 32310 USA
基金
美国国家科学基金会;
关键词
nanocrystalline; copper; mechanical property; consolidation; deformation mechanism;
D O I
10.1016/j.actamat.2004.12.005
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improved combination of tensile strength and ductility, over the tensile properties of other nanocrystalline Cu materials documented in the literature. We also demonstrate the elvated strain rate sensitivity and strong temperature dependence of the flow stress and explain the results in terms of the thermally activated deformation mechanisms operative in the nanocrystalline grains. The nearly perfectly plastic behavior and shear localization observed are discussed and compared with the strain hardening behavior and deformation modes known for other nanocrystalline metals. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1521 / 1533
页数:13
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