Dense, vertically aligned multiwalled carbon nanotube arrays as thermal interface materials

被引:294
作者
Tong, Tao [1 ]
Zhao, Yang
Delzeit, Lance
Kashani, Ali
Meyyappan, M.
Majumdar, Arun
机构
[1] Univ Calif Berkeley, Dept Mech Engn, Berkeley, CA 94720 USA
[2] Atlas Sci Inc, San Jose, CA 95120 USA
[3] NASA, Ames Res Ctr, Ctr Nanotechnol, Moffett Field, CA 94035 USA
[4] Lawrence Berkeley Natl Lab, Div Sci Mat, Berkeley, CA 94720 USA
来源
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2007年 / 30卷 / 01期
基金
美国国家航空航天局;
关键词
carbon nanotube (CNT); multiwalled; thermal interface material (TIM); thermo-reflectance;
D O I
10.1109/TCAPT.2007.892079
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance similar to 10(5) W/m(2) K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to similar to 10(6) W/m(2) K making it attractive as a TIM.
引用
收藏
页码:92 / 100
页数:9
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