Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization

被引：31

作者：

Hung, KC ^{[1
]}

Chan, YC ^{[1
]}

机构：

[1] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 2000年 / 19卷 / 19期

关键词：

D O I：

10.1023/A:1006735103744

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The results of nickel phosphate growth due to a solder reaction-assisted crystallization of electroless Ni-P metallization are presented. It is observed that the ceasing of the growth may be due to losses of phosphorous during soldering and the observation of Kirkendall void has confirmed that the loss of phosphorous is due to the diffusion of phosphorous through channels and grain boundaries into solder.

引用

页码：1755 / 1757

页数：3

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