Gated Si field emitter array prepared by using anodization

被引:7
作者
Higa, K [1 ]
Nishii, K [1 ]
Asano, T [1 ]
机构
[1] Kyushu Inst Technol, Ctr Microelect Syst, Iizuka, Fukuoka 820, Japan
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1998年 / 16卷 / 02期
关键词
D O I
10.1116/1.589875
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
High aspect-ratio gated field emitter arrays have been fabricated using silicon tip prepared by the anodization of a silicon wafer with periodic n/p junctions. The tips were formed by the preferential growth of porous silicon in p-type material and were transferred to a separate silicon substrate by direct bonding. Gate electrodes were then formed by depositing a WSi2 film over the tips, and apertures were subsequently coated by etching with an argon milling process. The resulting gated tip arrays demonstrated field emission, although higher than usual gate voltages were required. (C) 1998 American Vacuum Society. [S0734-211X(98)01102-0].
引用
收藏
页码:651 / 653
页数:3
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