Liquid crystal polymer-based integrated passive development for RF applications

被引：10

作者：

Davis, MF ^{[1
]}

Yoon, SW ^{[1
]}

Pinel, S ^{[1
]}

Lim, K ^{[1
]}

Laskar, J ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch ECE, NSF Packaging Res Ctr, Yamacraw Design Ctr, Atlanta, GA 30312 USA

来源：

2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2003年

关键词：

D O I：

10.1109/MWSYM.2003.1212573

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A Liquid Crystal Polymer (LCP) based multilayer packaging process is presented for RF/microwave applications. LCP is gaining increasing interest as a choice technology in the packaging community due to its superior thermal and electrical properties including low loss, low dielectric constant and low CTE characteristics. For the first time, we present a thorough study of the design, model, and measurement of integrated passives using LCP. A coplanar waveguide transmission line test structure demonstrates an insertion loss of .35dB at 23 GHz and a return loss better than 15dB to 30GHz. Quality factors (Q) in excess of 70 and a self resonance frequency (SRF) to 29GHz have been achieved. A bandpass filter implementation is also demonstrated to realize a c band module. Advantages of passive integration using built up LCP as opposed to multilayer organic are discussed.

引用

页码：1155 / 1158

页数：4