Pulse electrodeposition of Ni-Cu-Mo alloys

被引：17

作者：

BeltowskaLehman, E ^{[1
]}

Ozga, P ^{[1
]}

Chassaing, E ^{[1
]}

机构：

[1] CNRS,CTR ETUD CHIM MET,F-94407 VITRY,FRANCE

来源：

SURFACE & COATINGS TECHNOLOGY | 1996年 / 78卷 / 1-3期

关键词：

pulse plating; Ni-Cu-Mo alloys; electrodeposition;

D O I：

10.1016/0257-8972(94)02406-5

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Pulse plating of Ni-Cu-Mo alloy has been investigated using a series of planned experiments. A domain of pulse parameters has been defined where the coating quality is optimal. The current efficiency and the Mo content can be larger than in d.c. deposition especially at low average current density. Only the copper content in the deposited alloy can be described by a linear function of the pulse parameters (average current density, frequency and duty cycle). Owing to complex kinetics and interactions during the codischarge, the molybdenum and nickel contents do not obey simple analytical dependences on pulse parameters.

引用

页码：233 / 237

页数：5

共 20 条

[1]

[Anonymous], 1988, METHODE PLANS EXPERI

[2] ELECTRODEPOSITION OF NI-CU-MO TERNARY ALLOYS FROM CITRATE ELECTROLYTES [J].