Fabrication of multipurpose AFM/SCM/SEP microprobe with integrated piezoresistive deflection sensor and isolated conductive tip

Scanning microprobe with multipurpose capabilities is presented. Atomic Force Microscopy (AFM), Scanning Capacitance Microscopy (SCM) and Scanning Electrostatic Probing (SEP) measurements could be simultaneously performed with the silicon tip integrated with piezoresistive cantilever. Manufacturing process of the microprobe. based on double side bulk\surface micromachining of SOI substrates, is described. Presented results of measurements of the nearfield forces with nanometer resolution revealed that surface topography of the samples together with its electronic properties could be scanned. This makes our microprobe useful e.g. for surface analysis of submicron IC's.