Monolithic high-performance three-dimensional coil inductors for wireless communication applications

被引：59

作者：

Young, DJ ^{[1
]}

Malba, V ^{[1
]}

Ou, JJ ^{[1
]}

Bernhardt, AF ^{[1
]}

Boser, BE ^{[1
]}

机构：

[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA

来源：

INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST | 1997年

关键词：

D O I：

10.1109/IEDM.1997.649460

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An on-chip three-dimensional RF coil inductor is proposed as a key component to implement monolithic wireless transceivers. The device achieves a substantially superior performance compared to conventional spiral inductors, and is amenable to monolithic integration in a standard IC process due to its low thermal budget. Experimental devices fabricated on a standard silicon substrate (10 Ohm-cm) achieve a 2.6 nH inductance with a peak quality-factor (Q) of 13 at 900 MHz. The Q-factor is limited by a lossy adhesive used in the fabrication. In a modified process without adhesive in the coil area, a 4.8 nH inductor achieves a peak Q-value of 30 at 1 GHz. High-Q 8 nH and 13.8 nH inductors have also been fabricated.

引用

页码：67 / 70

页数：4