Curing of kiwifruit for control of postharvest infection by Botrytis cinerea

被引:20
作者
BautistaBanos, S [1 ]
Long, PG [1 ]
Ganesh, S [1 ]
机构
[1] MASSEY UNIV, DEPT STATIST, PALMERSTON NORTH, NEW ZEALAND
关键词
kiwifruit; Actinidia deliciosa; B-cinerea; curing; temperature; relative humidity;
D O I
10.1016/S0925-5214(97)00043-4
中图分类号
S3 [农学(农艺学)];
学科分类号
0901 ;
摘要
The effects of temperature and humidity during curing on subsequent infection levels of B. cinerea in kiwifruit were investigated in 1993 and 1994. After harvest, each fruit was inoculated with 25 000 spores in a 17 mu l droplet of Tween 20. Dry conidial application was also included in 1994 experiments. The largest curing effect was obtained at 10 degrees C. Disease incidence was highest at 0 degrees C and the curing effect diminished at temperatures above 10 degrees C. In 1994 a three day curing period was used and 10 degrees C gave the lowest subsequent disease incidence. After twelve weeks of cool storage (1993) there was less disease in fruit cured at 89-95% relative humidity than at lower humidities. In 1994, comparable results were obtained. Firmness fluctuated with harvest and in general, decreased with storage, although a satisfactory firmness was maintained throughout cool storage for all treatments. For all experiments, weight loss increased with increased curing temperature or with decreased relative humidity. (C) 1997 Elsevier Science B.V.
引用
收藏
页码:137 / 145
页数:9
相关论文
共 29 条
[1]  
Bautista-Banos S, 1995, ACTA HORTIC, P233, DOI 10.17660/ActaHortic.1995.398.24
[2]  
BEEVER DJ, 1992, NZ KIWIFRUIT FEB, P11
[3]  
BEEVER DJ, 1991, CURING KIWIFRUIT HAR, P18
[4]  
BENYEHOSHUA S, 1987, J AM SOC HORTIC SCI, V112, P658
[5]  
BENYEHOSHUA S, 1988, P 6 INT CITR C, V3, P1539
[6]  
BROOK PJ, 1990, REV BOTRYTIS CINEREA, P99
[7]  
Delate K., 1985, Proceedings of the Florida State Horticultural Society, V98, P187
[8]  
ELAD Y, 1992, RECENT ADVANCES IN BOTRYTIS RESEARCH, P147
[9]  
HOPKIRK G, 1990, STORAGE LIFE QUALITY, P41
[10]  
Ketsa S., 1994, Postharvest Biology and Technology, V4, P159, DOI 10.1016/0925-5214(94)90017-5