Tensile behavior of free-standing gold films. Part II. Fine-grained films

被引:100
作者
Emery, RD [1 ]
Povirk, GL [1 ]
机构
[1] Yale Univ, Dept Mech Engn, New Haven, CT 06520 USA
基金
美国国家科学基金会;
关键词
thin films; tensile testing; creep; grain boundary strengthening; grain size;
D O I
10.1016/S1359-6454(03)00007-7
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The room temperature mechanical behavior of thin gold films (0.2-2.0 mum thickness) was investigated through uniaxial tensile testing. Films were deposited by electron beam and thermal evaporation, under varying conditions, in order to produce films with different microstructures. This particular study concentrated on the behavior of the films with grain sizes of less than about 0.5 mum. The testing showed that these fine-grained films exhibited significant strain rate dependence, in contrast with a previous study of gold films with more coarse grain sizes [1]. The results are discussed in terms of existing theories for rate-dependent metals. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:2079 / 2087
页数:9
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