Feature integrity monitoring for process control using a CD SEM

被引：14

作者：

Allgair, J ^{[1
]}

Chen, G ^{[1
]}

Marples, S ^{[1
]}

Goodstein, D ^{[1
]}

Miller, J ^{[1
]}

Santos, F ^{[1
]}

机构：

[1] Motorola Inc, Adv Prod Res & Dev Lab, Austin, TX 78721 USA

来源：

METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XIV | 2000年 / 3998卷

关键词：

CD SEM; process control; linescan analysis; image analysis;

D O I：

10.1117/12.386475

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Rapidly accelerating technology roadmaps have put increased pressure on in-line process control. CDs measured by automated SEMs are a common element of in-line process control. However, CD measurements alone may not be enough in all cases for adequate process control. For instance, degradation of feature integrity that does not lead to out of control CDs in photo can lead to scrap after etch. The cost of scrap and loss of time to results associated with catching photo process drift with after etch inspection has forced the development of new tools to monitor feature integrity in the ADI CD inspection module. Likewise, partially closed vias that are not caught with etch CD inspection can have a negative impact on copper processes. We describe a feature integrity monitoring technique using an automated CD-SEM that occurs simultaneously with the CD measurement to monitor and detect process drift prior to out of control CD events. We further describe the implementation of this technique in a production environment.

引用

页码：227 / 231

页数：5