The wetting of copper by Al Zn Sn solders

被引：32

作者：

Lin, KL ^{[1
]}

Wen, LH ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 1998年 / 9卷 / 01期

关键词：

D O I：

10.1023/A:1008816212811

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Copper wetting times were measured for various Al-Zn-Sn solders using a wetting balance. Wettability of Cu with the Al-Zn-Sn solders was enhanced by increasing the Al and Zn contents. A scanning electron microscope (SEM) investigation on the solidified wetting sample revealed that diffusion of Al and Zn towards Cu is responsible for the observed wetting behaviour. The dipping speed is also important. (C) 1998 Chapman & Hall.

引用

页码：5 / 8

页数：4

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