The Al/Ni interfacial reactions under the influence of electric current

被引：43

作者：

Liu, WC ^{[1
]}

Chen, SW ^{[1
]}

Chen, CM ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 30043, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1998年 / 27卷 / 01期

关键词：

Al/Ni interfacial reactions; electrical current; electromigration;

D O I：

10.1007/s11664-998-0338-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Electromigration has been observed and quite extensively investigated in the compositionally homogeneous conducting lines in the integrated circuit devices; however, the effect of electric current upon the interfacial reactions has not been discussed. This study investigated the effect of electric current upon the chemically driven interfacial reactions in the Al/Ni system. Al/Ni reaction couples annealed at 400 degrees C with and without the passing of electric current were examined. Two intensities of electric currents, 5 x 10(2) A/cm(2) and 10(3) A/cm(2), were used in this study. Same intermetallics, Al3Ni and Al3Ni2, were formed at the interfaces; however, the thickness of the reaction layer in the reaction couples with the passing of electric current was much larger than those without electric current. This novel phenomenon has never been reported in the literature, and the understanding of its mechanism needs further investigation.

引用

页码：L5 / L8

页数：4

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