Present problems of power module packaging technology

被引：89

作者：

Shammas, NYA ^{[1
]}

机构：

[1] Staffordshire Univ, Sch Engn & Adv Technol, Stoke On Trent ST18 0DF, Staffs, England

来源：

MICROELECTRONICS RELIABILITY | 2003年 / 43卷 / 04期

关键词：

SEMICONDUCTOR-DEVICES;

D O I：

10.1016/S0026-2714(03)00019-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An overview of the problems encountered concerning power module performance and reliability is given and the main failure mechanisms are discussed. Experimental and simulation methods for the transient thermal characterisation of semiconductor packages are presented. An identification procedure that allows establishing the physical correspondence between the RC cells of the thermal model and the layers that constitute the electronic package is proposed. The results of tests on a number of commercial Smartpack(R) modules provide useful information about the influence of materials properties and geometry on the step response. These could be used for package quality control and reliability investigations. (C) 2003 Elsevier Science Ltd. All rights reserved.

引用

页码：519 / 527

页数：9

共 30 条

[1] Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization - Part I: Fundamentals and theory [J].

Bagnoli, PE ;

Casarosa, C ;

Ciampi, M ;

Dallago, E .

IEEE TRANSACTIONS ON POWER ELECTRONICS, 1998, 13 (06) :1208-1219

[2]

BAGNOLI PE, 1995, EPE 95 C P SEVILLE, V3, P322

[3]

CHAMUND D, 2002, P 37 INT U POW ENG C, P262

[4] THERMAL-STRESS IN BONDED JOINTS [J].

CHEN, WT ;

NELSON, CW .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1979, 23 (02) :179-188

[5]

CHRISTIAENS B, 1996, MICROELECTRON J, V25, P1807

[6] Absolute measurement of transient carrier concentration and temperature gradients in power semiconductor devices by internal IR-laser deflection [J].

Deboy, G ;

Solkner, G ;

Wolfgang, E ;

Claeys, W .

MICROELECTRONIC ENGINEERING, 1996, 31 (1-4) :299-307

[7]

ENGEL K, 10 INT S HIGH VOLT E, P189

[8]

ENGEL K, 1997, INT C DIEL INS BUD H, P229

[9] Packaging factors affecting the fatigue life of power transistor die bonds [J].

Evans, J ;

Evans, JY .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (03) :459-468

[10] Thermal management of power electronics modules packaged by a stacked-plate technique [J].

Haque, S ;

Stinnett, WA ;

Nelson, DJ ;

Lu, GQ .

MICROELECTRONICS RELIABILITY, 1999, 39 (09) :1343-1349

← 1 2 3 →