MEMS post-packaging by localized heating and bonding

被引：127

作者：

Lin, LW ^{[1
]}

机构：

[1] Univ Calif Berkeley, Dept Mech Engn, Berkeley, CA 94720 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2000年 / 23卷 / 04期

基金：

美国国家科学基金会;

关键词：

CVD bonding; eutectic bonding; fusion bonding; MEMS; packaging; solder bond;

D O I：

10.1109/6040.883749

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging filed of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also speeds up the product commercialization cycle. A review of engineering bases describing current technologies of MEMS packaging and wafer bonding is followed by an innovative post-packaging approach by localized heating and bonding. Process demonstrations by selective encapsulation are presented, including an integrated low pressure chemical vapor deposition (LPCVD) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

引用

页码：608 / 616

页数：9

共 62 条

[1] A modular micromachined high-density connector for implantable biomedical systems [J].

Akin, T ;

Ziaie, B ;

Najafi, K .

NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, :497-502

[2]

[Anonymous], J APPL PHYS B

[3]

[Anonymous], SOLDERING ELECT

[4] ANODIC BONDING OF IMPERFECT SURFACES [J].

ANTHONY, TR .

JOURNAL OF APPLIED PHYSICS, 1983, 54 (05) :2419-2428

[5]

Audet S. A., 1997, P 1997 INT C SOL STA, P287

[6] THE PACKAGING OF IMPLANTABLE INTEGRATED SENSORS [J].

BOWMAN, L ;

MEINDL, JD .

IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING, 1986, 33 (02) :248-255

[7]

BUTLER J, 1997, P TRANSD 97, P261

[8] Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging [J].

Cheng, YT ;

Lin, LW ;

Najafi, K .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (01) :3-8

[9]

Cheng YT, 1999, PROC IEEE MICR ELECT, P285, DOI [10.1109/MEMSYS.1999.746837, 10.1109/SSDM.1999.787652]

[10]

COHN MB, 1996, P IEEE SOL STAT SENS, P32

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