Mechanical characterization of solution-derived nanoparticle silver ink thin films

Mechanical properties of sintered silver nanoparticles are investigated via substrate curvature and nanoindentation methods. Substrate curvature measurements reveal that permanent microstructural changes occur during initial heating while subsequent annealing results in nearly elastic behavior of the thinner films. Thicker films were found to crack upon thermal treatment. The coefficient of thermal expansion was determined from linear slopes of curvature curves to be 1.9 +/- 0.097 ppm/degrees C, with elastic modulus and hardness determined via nanoindentation. Accounting for substrate effects, nanoindentation hardness and modulus remained constant for different film thicknesses and did not appear to be a function of annealing conditions. Hardness of 0.91 GPa and modulus of 110 GPa are somewhat lower than expected for a continuous nanocrystalline silver film, most likely due to porosity. (c) 2007 American Institute of Physics.