Compositions of MgTiO3-CaTiO3 ceramic with two borosilicate glasses for LTCC technology

被引：227

作者：

Jantunen, H

Rautioaho, R

Uusimäki, A

Leppävuori, S

机构：

[1] Univ Oulu, Microelect Lab, FIN-90014 Oulu, Finland

[2] Univ Oulu, EMPART Res Grp, Infotech Oulu, FIN-90014 Oulu, Finland

[3] Univ Oulu, Mat Engn Lab, FIN-90014 Oulu, Finland

来源：

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY | 2000年 / 20卷 / 14-15期

基金：

芬兰科学院;

关键词：

dielectric properties; glass ceramics; MgTiO3-CaTiO3; sintering; substrates;

D O I：

10.1016/S0955-2219(00)00145-X

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Mixtures of ZnO-SiO2-B2O3/MgTiO3-CaTiO3 (ZSB/MMT-20) and BaO-SiO2-B2O3/MgTiO3-CaTiO3 (BSB/MMT-20) have been investigated as new candidates for LTCC dielectric materials. Two-stage sintering behaviour was observed in both materials, starting at around 600 and 850 degreesC. Nearly full density (97%) was achieved in ZSB/MMT-20 after sintering at 900 degreesC, while a high porosity of 23% was measured in BSB/MMT-20 after firing at 875 degreesC followed by partial melting of samples during sintering at 900 degreesC. After firing, fully crystalline structure with phases of ZnTiO3, Zn2SiO4, Mg4/3Zn2/3B2O5 and TiO2 were found in ZSB/MMT-20, while the structure of BSB/MMT-20 consisted of crystalline TiO2 and BaTi(BO3)(2) and amorphous SiBa(BO3)(2) and SiB2O5 ZSB/MMT-20 fired at 900 degreesC showed promising microwave properties having the dissipation factor of 0.001 and a permittivity of 10.6 at 7 GHz. The corresponding values for BSB/MMT-20 fired at 875 degreesC were 0.002 and 8.2, respectively. (C) 2000 Elsevier Science Ltd. All rights reserved.

引用

页码：2331 / 2336

页数：6

共 11 条

[1]

ABE M, 1996, Patent No. 5493262

[2] A new low loss lead free LTCC system for wireless and RF applications [J].

Donohue, PC ;

Taylor, BE ;

Amey, DI ;

Draudt, RR ;

Smith, MA ;

Horowitz, SJ ;

Larry, JR .

1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, :196-199

[3]

Hakki B. W., 1960, IEEE Trans. Microwave Theory Techn, V8, P402, DOI DOI 10.1109/TMTT.1960.1124749

[4]

KATOH T, 1994, Patent No. 5340784

[5] Low loss, low temperature cofired ceramics with higher dielectric constants for multichip modules (MCM) [J].

Kniajer, G ;

Dechant, K ;

Apte, P .

1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, :121-127

[6]

KNICKERBOCKER SH, 1993, AM CERAM SOC BULL, V72, P90

[7]

LEVIN EM, 1964, PHASE DIAGRAMS CERAM

[8]

MCMILLAN PW, 1979, GLASS CERAM, P208

[9] LTCC technology: Where we are and where we're going - II [J].

Scrantom, CQ ;

Lawson, JC .

1999 IEEE MTT-S SYMPOSIUM ON TECHNOLOGIES FOR WIRELESS APPLICATIONS DIGEST, 1999, :193-200

[10] EFFECTS OF GLASS ADDITIONS ON (ZR,SN)TIO4 FOR MICROWAVE APPLICATIONS [J].

TAKADA, T ;

WANG, SF ;

YOSHIKAWA, S ;

JANG, SJ ;

NEWNHAM, RE .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1994, 77 (09) :2485-2488

← 1 2 →