Electrochemical applications of in situ scanning probe microscopy

[1] EFFECT OF UNDERPOTENTIAL DEPOSITION (UPD) OF COPPER ON OXYGEN REDUCTION AT PT(111) SURFACES [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1995, 382 (1-2): : 73 - 83

[2] TOTAL INHIBITION OF THE OXYGEN REDUCTION REACTION AT AU(111) BY COPPER ADLAYERS IN SULFURIC-ACID-SOLUTION [J]. BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN, 1994, 67 (08) : 2075 - 2078

[3] ADZIC RR, 1984, ADV ELECTROCH EL ENG, V13, P159

[4] ADZIC RR, 1993, SURF SCI, V293, pL876, DOI 10.1016/0039-6028(93)90299-Y

[5] Allongue P, 1995, NATO ADV SCI INST SE, V288, P45

[6] INSITU STM OBSERVATIONS OF THE ETCHING OF N-SI(111) IN NAOH SOLUTIONS [J]. SURFACE SCIENCE, 1992, 275 (03) : 414 - 423

[7] PULSE PLATING ON GOLD SURFACES STUDIED BY IN-SITU SCANNING-TUNNELING-MICROSCOPY [J]. SURFACE & COATINGS TECHNOLOGY, 1994, 67 (03) : 151 - 159

[8] Bulk copper electrodeposition on gold imaged by in situ STM: Morphology and influence of tip potential [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1996, 26 (02) : 161 - 170

[9] GROWTH OF A COPPER-GOLD ALLOY PHASE BY BULK COPPER ELECTRODEPOSITION ON GOLD INVESTIGATED BY IN-SITU STM [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (07) : 2225 - 2232

[10] Layer-by-layer anodic dissolution of sulfur-modified Ni(100) electrodes: In situ scanning tunneling microscopy [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1996, 412 (1-2): : 139 - 146

[1] EFFECT OF UNDERPOTENTIAL DEPOSITION (UPD) OF COPPER ON OXYGEN REDUCTION AT PT(111) SURFACES [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1995, 382 (1-2): : 73 - 83

[2] TOTAL INHIBITION OF THE OXYGEN REDUCTION REACTION AT AU(111) BY COPPER ADLAYERS IN SULFURIC-ACID-SOLUTION [J]. BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN, 1994, 67 (08) : 2075 - 2078

[3] ADZIC RR, 1984, ADV ELECTROCH EL ENG, V13, P159

[4] ADZIC RR, 1993, SURF SCI, V293, pL876, DOI 10.1016/0039-6028(93)90299-Y

[5] Allongue P, 1995, NATO ADV SCI INST SE, V288, P45

[6] INSITU STM OBSERVATIONS OF THE ETCHING OF N-SI(111) IN NAOH SOLUTIONS [J]. SURFACE SCIENCE, 1992, 275 (03) : 414 - 423

[7] PULSE PLATING ON GOLD SURFACES STUDIED BY IN-SITU SCANNING-TUNNELING-MICROSCOPY [J]. SURFACE & COATINGS TECHNOLOGY, 1994, 67 (03) : 151 - 159

[8] Bulk copper electrodeposition on gold imaged by in situ STM: Morphology and influence of tip potential [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1996, 26 (02) : 161 - 170

[9] GROWTH OF A COPPER-GOLD ALLOY PHASE BY BULK COPPER ELECTRODEPOSITION ON GOLD INVESTIGATED BY IN-SITU STM [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (07) : 2225 - 2232

[10] Layer-by-layer anodic dissolution of sulfur-modified Ni(100) electrodes: In situ scanning tunneling microscopy [J]. JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1996, 412 (1-2): : 139 - 146