Recycling of epoxy resin compounds for moulding electronic components

被引：42

作者：

Iji, M ^{[1
]}

机构：

[1] NEC Corp Ltd, Resources & Environm Protect Res Labs, Ecol Based Syst Res Lab, Miyamae Ku, Kawasaki, Kanagawa 216, Japan

来源：

JOURNAL OF MATERIALS SCIENCE | 1998年 / 33卷 / 01期

关键词：

Epoxy; Surface Reactivity; Silanol; Electronic Component; Surface Hardness;

D O I：

10.1023/A:1004329209623

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study reports the recycling of the cured epoxy resin compounds containing silica filler and additives for moulding electronic components, which is generated as a mould residue in moulding process. The pulverized residue (moulding resin powder) showed good surface reactivity due to the functional groups contained (silanol, hydroxy and epoxy) and reacted with polar resins such as epoxy resin and phenol resin in a similar manner to silica powder. Recycling a low-stress-type moulding resin powder containing silicone elastomer into a standard moulding resin yielded a new moulding resin that has far better thermal impact resistance than that made with the original standard moulding resin. Moreover, the moulding resin powder was found to be suitable as a filler for epoxy resin products such as insulating materials, paints and adhesives to supply them with sufficient insulating, strength and adhesive properties. Use of the powder as a decorating agent for an acrylic-resin-type construction material also produced a marble-like appearance and improved the surface hardness of the material.

引用

页码：45 / 53

页数：9

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