Thermal conductivity and RF signal transmission properties of Ag-filled epoxy resin

被引：3

作者：

Kimura, T ^{[1
]}

Nakai, T ^{[1
]}

Ishikawa, H ^{[1
]}

Ooyama, C ^{[1
]}

Oosawa, K ^{[1
]}

Kohinata, S ^{[1
]}

机构：

[1] Sumitomo Met Ind Ltd, Tokyo 1988601, Japan

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

D O I：

10.1109/ECTC.2003.1216475

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

In order to expand the application areas of the Ag-filled epoxy resin, the most popular metal-filled conductive resin in electronics packaging industry, the thermal and electrical properties varying with the material parameters of Ag-filled epoxy resin were focused. Thickness of the Ag-filled epoxy resin for die attachment is usually 5 to 10mum. The self-standing specimens with thickness similar to the actual die attachment layer were prepared and the thermal properties were measured. The thermal diffusivitiy of the Ag-filled epoxy resin was found to depend on the thickness. The results show that the thermal conductivity of highly Ag concentrated Ag-filled epoxy resin with Ag contents ranging from 45 to 60 vol% is larger than that expected from theoretical equation. S parameters of the microstrip lines using our own in-house developed Ag-filled epoxy resins were measured in the frequency range up to 30GHz. The Ag-filled epoxy resins are found to be classified into two distinct groups in terms of the attenuation constants. One group shows very good transmittivity similar to a typical metal line up to 30 GHz. The other group shows large attenuation constants. The attenuation constants of the lines made with the Ag-filled epoxy resins were not affected by heat treatment. It indicates the possibility that the Ag-filled epoxy resin can be applied to the RF application industry.

引用

页码：1383 / 1390

页数：8

共 10 条

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