Bottom-up soft-lithographic fabrication of three-dimensional multilayer polymer integrated optical microdevices

被引:16
作者
Huang, YY [1 ]
Paloczi, GT [1 ]
Poon, JKS [1 ]
Yariv, A [1 ]
机构
[1] CALTECH, Dept Appl Phys, Pasadena, CA 91125 USA
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.1802380
中图分类号
O59 [应用物理学];
学科分类号
摘要
We: develop a method to efficiently fabricate three-dimensional multilayer polymer microchips for integrated optical applications. This method uses soft lithography to mold the core structures on top of the cladding, layers. By repeating the process, a three-dimensional multilayer integrated optical microdevice, which consists of several layers of individual planar optical devices, is fabricated. We demonstrate a dual-layer microring resonator optical filter device where the devices in the different layers show essentially identical transmission responses. (C) 2004 American Institute of Physics.
引用
收藏
页码:3005 / 3007
页数:3
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