The enhanced PC and PEC oxidation of formic acid in aqueous solution using a Cu-TIO2/ITO film

被引:22
作者
He, C
Li, XZ [1 ]
Xiong, Y
Zhu, XH
Liu, SR
机构
[1] Zhongshan Univ, Sch Chem & Chem Engn, Guangzhou 510275, Peoples R China
[2] Hong Kong Polytech Univ, Dept Civil & Struct Engn, Kowloon, Hong Kong, Peoples R China
[3] Texas Tech Univ, Dept Chem & Biochem, Lubbock, TX 79400 USA
基金
中国国家自然科学基金;
关键词
Cu deposition; formic acid; photocatalysis; photoelectrochemistry; TiO2;
D O I
10.1016/j.chemosphere.2004.09.041
中图分类号
X [环境科学、安全科学];
学科分类号
08 [工学]; 0830 [环境科学与工程];
摘要
The photocatalytic (PC) and photoelectrocatalytic (PEC) activity of Cu-TiO2/ITO films for degrading formic acid in aqueous solution was investigated in this study. Compared with a TiO2/ITO film, the degradation efficiency of formic acid on the Cu-TiO2, films increased markedly in both the PC and PEC oxidation processes. However, it was found that the photodeposited Cu metal on the Cu-TiO2, films could electrochemically dissolute during the PEC reaction, while an electrical bias with the voltage higher than 1.48V was applied. It is believed this is a common problem occurred for several metals deposition on the TiO2 films, which results in a poor stability of the metal-deposited TiO2 electrode in PEC processes. To improve the stability of the Cu-TiO2, electrode, an alternative process between PC and PEC reactions was investigated. It was found that the dissolute Cu metal during the PEC process seas re-deposited on the Cu-TiO2 film again during the PC process. The experiments with repeated runs demonstrated that this alternative process: could not only overcome the loss of Cu, but also enhance the PEC oxidation efficiency of the Cu-TiO2 film. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:381 / 389
页数:9
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