Fabrication, Modeling, and Application of Ceramic-Thermoplastic Composites for Fused Deposition Modeling of Microwave Components

被引:46
作者
Castro, Juan [1 ]
Rojas-Nastrucci, Eduardo A. [1 ]
Ross, Anthony [1 ]
Weller, Thomas M. [1 ]
Wang, Jing [1 ]
机构
[1] Univ S Florida, Dept Elect Engn, Ctr Wireless & Microwave Informat Syst, Tampa, FL 33620 USA
基金
美国国家科学基金会;
关键词
Additive manufacturing (AM); antennas; composite materials; dielectric losses; permittivity; 3-D printing;
D O I
10.1109/TMTT.2017.2655057
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];
摘要
A new kind of high permittivity (high-k) and low-loss composite material for fused deposition modeling (FDM) technology based on a cyclo-olefin polymer (COP) thermoplastic matrix embedded with sintered ceramic fillers was developed and characterized up to Ku-band. FDM printed samples made of 30 vol.% COP-MgCaTiO2 composites, with filler particles sintered at 1200 degrees C, show a relative permittivity (epsilon(r)) of 4.82 and a loss tangent (tan delta) below 0.0018. Meanwhile, 3-D-printed samples composed of 25 vol.% COP-Ba0.55Sr0.45TiO3 with particles sintered at 1340 degrees C exhibit a er of 4.92 and a tan delta lower than 0.0114. Also, 30 vol.% COP-TiO2 specimens with filler particles sintered at 1200 degrees C exhibit a epsilon(r) of 4.78 and a low tan delta lower than 0.0012, whereas acrylonitrile butadiene styrene-Ba0.55Sr0.45TiO3 specimens with a 6% volume fraction loading of microparticle fillers sintered at 1340 degrees C have demonstrated a epsilon(r) of 3.98 and a tan delta less than 0.0086. Edge-fed microstrip patch antennas operating at 17 GHz were fabricated by a direct digital manufacturing (DDM) approach that combines FDM of electromagnetic composites and microdispensing for deposition of conductive traces and compared with reference designs implemented using commercial microwave laminates regarding antenna size and performance. Evidently, the newly developed ceramic-thermoplastic composites are well suited for microwave device applications up to Ku-band and can be adapted to 3-D printing technologies.
引用
收藏
页码:2073 / 2084
页数:12
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