Characterization of thin film microstrip lines on polyimide

被引:92
作者
Ponchak, GE [1 ]
Downey, AN [1 ]
机构
[1] NASA, Lewis Res Ctr, Electron Device Technol Branch, Cleveland, OH 44135 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1998年 / 21卷 / 02期
关键词
microstrip; microwave; multilayer; polyimide; transmission lines;
D O I
10.1109/96.673705
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents an in depth characterization of thin film microstrip (TFMS) fines fabricated on Dupont PI-2611 polyimide. Measured attenuation and effective dielectric constant is presented for TFMS lines with thicknesses from 2.45-7.4 mu m and line widths from 5-34.4 mu m over the frequency range of 1-110 GHz. The attenuation is separated into conductor and dielectric losses to determine the loss tangent of Dupont PI-2611 polyimide over the microwave frequency range. In addition, the measured characteristics are compared to closed form equations for alpha and epsilon(eff) from the literature. Based on the comparisons, recommendations for the best closed form design equations for TFMS are made.
引用
收藏
页码:171 / 176
页数:6
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