An overview of thermal management for next generation microelectronic devices

被引：34

作者：

Tonapi, SS ^{[1
]}

Fillion, RA ^{[1
]}

Schattenmann, FJ ^{[1
]}

Cole, HS ^{[1
]}

Evans, JD ^{[1
]}

Sammakia, BG ^{[1
]}

机构：

[1] Gen Elect Global Res, Niskayuna, NY 12301 USA

来源：

ASCMC 2003: IEEE/SEMI (R) ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, PROCEEDINGS | 2003年

关键词：

thermal management; microelectronics; thermal interface material; electronic packaging;

D O I：

10.1109/ASMC.2003.1194502

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

引用

页码：250 / 254

页数：5

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