We have developed the first ever low-energy, high-dosage boron ion implantation technology using a decaborane (B10H14) molecule. Since B10H14 consists of ten boron atoms, they are implanted with about a one-tenth lower effective acceleration energy and a ten times higher effective beam current compared with those of boron. Using this implantation, we achieved an ultra-shallow 39-nm-deep junction with 1.5 k Omega/sq. To demonstrate the effect and feasibility for semiconductor devices, we have fabricated a high-performance 0.15-mu m PMOS device with excellent resistance to short-channel effects.