Self-healing of a high temperature cured epoxy using poly(dimethylsiloxane) chemistry

被引：86

作者：

Mangun, C. L. ^{[1
]}

Mader, A. C. ^{[2
]}

Sottos, N. R. ^{[3
,4
]}

White, S. R. ^{[4
,5
]}

机构：

[1] CU Aerosp, Champaign, IL 61820 USA

[2] Hsch Bremen, D-28199 Bremen, Germany

[3] UIUC, Dept Mat Sci & Engn, Urbana, IL 61801 USA

[4] UIUC, Beckman Inst, Urbana, IL 61801 USA

[5] UIUC, Dept Aerosp Engn, Urbana, IL 61801 USA

来源：

POLYMER | 2010年 / 51卷 / 18期

关键词：

Autonomic materials; Self-healing; Microcapsules;

D O I：

10.1016/j.polymer.2010.06.050

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

A high temperature cured self-healing epoxy is demonstrated by incorporating microcapsules of poly (dimethylsiloxane) (PDMS) resin and separate microcapsules containing an organotin catalyst. Healing is triggered by crack propagation through the embedded microcapsules in the epoxy matrix, which releases the healing agents into the crack plane initiating crosslinking reactions. A series of tapered double-cantilever beam (TDCB) fracture tests were conducted to measure virgin and healed fracture toughness. Healing efficiencies, based on fracture toughness recovery, ranged from 11 to 51% depending on the molecular weight of PDMS resin, quantity of healing agent delivered, and use of adhesion promoters. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：4063 / 4068

页数：6

共 10 条

[1] Self-healing flexible laminates for resealing of puncture damage [J].