A voltammetric analysis has been employed as a means for investigating behaviour of the electrochemical deposit of silver-cobalt and silver-iron granular thin films. In this paper, we report that by controlling some electrochemical variables such as the concentration of complexing additives, the silver deposition will be controlled diffusionally. Based on these considerations, periodic perturbations have been used as electrodeposition technique, because with pulsed current we can control several variables to change the kind of deposition, which produce considerable modifications on electrodeposits as far as the morphology, roughness, structure of electrodeposits, alloy ratio and consequently the magnetic behaviour. We have focused on how the pulsed parameters can change the alloy composition.