Methods used to deposit and integrate solution-processed materials to fabricate TFT back-planes-by ink-jet printing are discussed. Thematerials studied allow the development of an all-additive process in which materials are deposited only where their functionality is required. The metal layer and semiconductor are printed, and the solution-processed dielectric is spin-coated. Silver nanoparticles are used as gate and data metals, the semiconductor used is a polythiophene derivative (PQT-12), and the gate dielectric is an epoxy-based photopolymer. The maximum processing temperature used is 150 C, making the process compatible with flexible substrates. The I-ON/I-OFF ratio was found to be about 10(5) - 10(6), and TFT mobilities of 0.04 cm(2)/V-sec were obtained. The influence of surface treatments on the size and shape of printed features is presented. It is shown that coffee-stain effects can be controlled with ink formulation and that devices show the expected pixel response.