Performance of repaired defects and attPSM in EUV multilayer masks

被引:16
作者
Deng, YF [1 ]
La Fontaine, B [1 ]
Neureuther, AR [1 ]
机构
[1] Univ Calif Berkeley, Elect Res Lab, Berkeley, CA 94720 USA
来源
22ND ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PTS 1 AND 2 | 2002年 / 4889卷
关键词
EUV lithography; non-planar multilayer; buried defects; defect imaging; defect repair; topography removal; topography compaction; attenuated phase-shifting masks;
D O I
10.1117/12.467896
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
The imaging performance of non-planar topographies in EUV masks for both partially repaired defects and non-planar attenuating phase-shifting masks made with repair treatments are evaluated using rigorous electromagnetic simulation with TEMPEST. Typical topographies produced by treatment techniques in the literature such as removal of top layers and compaction produced by electron-beam heating are, considered. Isolated defects on/near the surface repaired by material removal are shown to result in an image intensity within 5% of the clear field value. Deeply buried defects within the multilayer treated by electron-beam heating can be repaired to 3% of the clear field but over repair can result in some degradation. Compaction from a 6.938 nm period to a 6.312 nm period shows a 540degrees phase-shift and an intensity reduced to about 6% suggesting such a treatment may be used to create attenuated phase-shifting masks for EUV. The quality of the aerial image for such a mask is studied as a function of the lateral transition distance between treated and untreated regions.
引用
收藏
页码:418 / 425
页数:8
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