Microscale resin-bonded permanent magnets for magnetic micro-electro-mechanical systems applications

被引:23
作者
Cho, HJ
Ahn, CH
机构
[1] Univ Cent Florida, Dept Mech Mat & Aerosp Engn, Orlando, FL 32816 USA
[2] Univ Cincinnati, Dept Elect & Comp Engn & Comp Sci, Microsyst & BioMEMS Lab, Cincinnati, OH 45221 USA
关键词
D O I
10.1063/1.1558591
中图分类号
O59 [应用物理学];
学科分类号
摘要
A micromachining technique has been developed for the fabrication of microscale resin-bonded permanent magnets. Magnetic paste has been prepared from Sr-ferrite powder and an epoxy resin, filled into lithographically defined molds, and formed into resin-bonded magnets after room temperature curing. Coercivity of 356 kA/m (4480 Oe), retentivity of 33 mT (330 G), and energy density of 2.7 kJ/m(3) have been achieved in 65-mum-thick disk arrays with lateral dimensions ranging from 50 to 200 mum. Based on the developed magnet, a magnetic MEMS actuator has been designed, fabricated, and characterized. Actuation current up to +/-60 mA operated the actuator up to 70 mum in attractive and repulsive motion. This work can be used for producing thick-film type permanent magnets, which can be scaled from a few tens of micrometers to millimeters on various substrates. (C) 2003 American Institute of Physics.
引用
收藏
页码:8674 / 8676
页数:3
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