Charge trapping related threshold voltage instabilities in high permittivity gate dielectric stacks

被引:271
作者
Zafar, S [1 ]
Callegari, A [1 ]
Gusev, E [1 ]
Fischetti, MV [1 ]
机构
[1] IBM Corp, Div Res, TJ Watson Res Ctr, Semicond Res & Dev Ctr, Yorktown Hts, NY 10598 USA
关键词
D O I
10.1063/1.1570933
中图分类号
O59 [应用物理学];
学科分类号
摘要
An experimental and modeling study of charge trapping related threshold voltage shifts in Al2O3 and HfO2 n-type field effect transistors (nFET) is reported. The dependence of threshold voltage, subthreshold slope, and gate leakage currents on stressing time and injected charge,carrier density are investigated as a function positive bias stress-voltage and temperature. Based on experimental data, a model for trapping of charges in the existing traps is developed. The model is similar to SiO2 charge trapping models with one exception. Unlike SiO2 models, the model assumes a continuous distribution in trapping capture cross sections. The model predicts that threshold voltage would increase with a power law dependence on stressing time and injected charge carrier density (N-inj) in the initial stages of stressing. The model calculates threshold voltage shifts as a function of stress time and Ninj, thereby provides estimates of threshold voltage shifts after 10 years lifetime. It also provides insights into the nature of traps by estimating trapping capture cross sections. The calculated results are shown to be consistent with both Al2O3 and HfO2 data over several decades of stressing time and N-inj. Using the model, a comparison between Al2O3 and HfO2 is made. In addition, the model is compatible with charge trapping data reported by, other research groups. (C) 2003 American Institute, of Physics.
引用
收藏
页码:9298 / 9303
页数:6
相关论文
共 22 条
[1]  
[Anonymous], UNPUB
[2]   80 nm poly-silicon gated n-FETs with ultra-thin Al2O3 gate dielectric for ULSI applications [J].
Buchanan, DA ;
Gusev, EP ;
Cartier, E ;
Okorn-Schmidt, H ;
Rim, K ;
Gribelyuk, MA ;
Mocuta, A ;
Ajmera, A ;
Copel, M ;
Guha, S ;
Bojarczuk, N ;
Callegari, A ;
D'Emic, C ;
Kozlowski, P ;
Chan, K ;
Fleming, RJ ;
Jamison, PC ;
Brown, J ;
Arndt, R .
INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, :223-226
[3]   Ultimate limit for defect generation in ultra-thin silicon dioxide [J].
DiMaria, DJ ;
Stathis, JH .
APPLIED PHYSICS LETTERS, 1997, 71 (22) :3230-3232
[4]  
GOUSEV E, 2001, INT EL DEV M 2001, P451
[5]   Charge trapping in very thin high-permittivity gate dielectric layers [J].
Houssa, M ;
Stesmans, A ;
Naili, M ;
Heyns, MM .
APPLIED PHYSICS LETTERS, 2000, 77 (09) :1381-1383
[6]  
HOUSSA M, 2000, SEMICOND SCI TECH, V16, P93
[7]  
KIM I, 2001, P INT S RAP THERM OT, V2, P211
[8]   CASCADE CAPTURE OF ELECTRONS IN SOLIDS [J].
LAX, M .
PHYSICAL REVIEW, 1960, 119 (05) :1502-1523
[9]   Quantum-mechanical modeling of electron tunneling current from the inversion layer of ultra-thin-oxide nMOSFET's [J].
Lo, SH ;
Buchanan, DA ;
Taur, Y ;
Wang, W .
IEEE ELECTRON DEVICE LETTERS, 1997, 18 (05) :209-211
[10]   STRESS RELAXATION FUNCTION OF GLASS [J].
MAJUMDAR, CK .
SOLID STATE COMMUNICATIONS, 1971, 9 (13) :1087-&