In situ measurement of misalignment errors in free-space optical interconnects

被引：6

作者：

Boisset, GC ^{[1
]}

Rolston, DR ^{[1
]}

Robertson, B ^{[1
]}

Liu, YS ^{[1
]}

Iyer, R ^{[1
]}

Kabal, D ^{[1
]}

Plant, DV ^{[1
]}

机构：

[1] McGill Univ, Dept Elect Engn, Montreal, PQ H3A 2A7, Canada

来源：

JOURNAL OF LIGHTWAVE TECHNOLOGY | 1998年 / 16卷 / 05期

关键词：

alignment diagnostic; boundary scan; free-space optical interconnect; optical backplane; optical packaging; optomechanics;

D O I：

10.1109/50.669016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A nonobtrusive technique for measuring misalignment errors in multistage free-space optical interconnects is proposed. The technique makes use of dedicated microoptics to relay higher order dedicated alignment beams generated by an optical power supply onto alignment detectors located on the periphery of a smart pixel chip. An implementation of this technique for measuring lateral (x-y) misalignment error in a multistage optical backplane demonstrator is then presented. Performance parameters are analyzed and future directions such as photonic extensions to electronic boundary scan standards are suggested.

引用

页码：847 / 858

页数：12

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