3D-structuring of photosensitive glasses

被引：6

作者：

Feindt, K ^{[1
]}

Harnisch, A ^{[1
]}

Zoppig, V ^{[1
]}

Hulsenberg, D ^{[1
]}

Kallenbach, E ^{[1
]}

机构：

[1] Tech Univ Ilmenau, Fac Mech Engn, D-98684 Ilmenau, Germany

来源：

MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/MEMSYS.1998.659755

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Up to now it is possible to etch through the whole wafer or in a defined depth, but not with the same etching process. Structures with a defined depth had to be produced with a second W-exposure followed by a second etching process. A new technology allows a 3D etching process in photosensitive glass. A lot of lines with a defined width and pattern are made in a chromium layer on vitreous silica. A pattern of different grey scales can be produced with that technology. The grey scale mask results in different intensities of UV-light during the exposure. Due to the different intensities, the exposure of different areas is in various depths. The advantage of this technology is that structures not only with a defined depth but also with a defined design can be produced.

引用

页码：207 / 210

页数：4