Analysis on the cooling performance of the thermoelectric micro-cooler

被引：97

作者：

Lee, Kong Hoon ^{[1
]}

Kim, Ook Joong ^{[1
]}

机构：

[1] Korea Inst Machinery & Mat, Energy Syst Res Ctr, Taejon 305343, South Korea

来源：

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2007年 / 50卷 / 9-10期

关键词：

D O I：

10.1016/j.ijheatmasstransfer.2006.09.037

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Numerical analysis has been carried out to figure out the performance of the thermoelectric micro-cooler with the three-dimensional model. A small-size and column-type thermoelectric cooler is considered and Bi2Te3 and Sb2Te3 are selected as the n- and p-type thermoelectric materials, respectively. The thickness of a thermoelectric element considered is 5-20 mu m. The effect of parameters such as the temperature difference, the current, the thickness of a thermoelectric element, and the number of thermoelectric pairs on the performance of the cooler has been investigated. The predicted results show that the performance can be improved for the thick element with the large number of thermoelectric pairs or the small cross-sectional area of the element. (c) 2006 Elsevier Ltd. All rights reserved.

引用

页码：1982 / 1992

页数：11

共 12 条

[1]

Bartkowiak M, 2001, SEMICONDUCT SEMIMET, V70, P245

[2] New thermoelectric components using microsystem technologies [J].

Böttner, H ;

Nurnus, J ;

Gavrikov, A ;

Kühner, G ;

Jägle, M ;

Künzel, C ;

Eberhard, D ;

Plescher, G ;

Schubert, A ;

Schlereth, KH .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (03) :414-420

[3] Thermoelectric micro devices:: Current state, recent developments and future aspects for technological progress and applications [J].

Böttner, H .

XXI INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '02, 2002, :511-518

[4] Micro-thermoelectric cooler: interfacial effects on thermal and electrical transport [J].

da Silva, LW ;

Kaviany, M .

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2004, 47 (10-11) :2417-2435

[5]

DASILVA LW, 2004, P ASME HT FED 2004

[6] THE ELECTRON PHONON DRAG AND TRANSPORT PHENOMENA IN SEMICONDUCTORS [J].

GUREVICH, YG ;

MASHKEVICH, OL .

PHYSICS REPORTS-REVIEW SECTION OF PHYSICS LETTERS, 1989, 181 (06) :327-394

[7]

Lim JR, 2002, XXI INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS ICT '02, P535

[8]

Rowe D. M., 1995, HDB THERMOELECTRICS

[9] Thermoelectric microdevice fabricated by a MEMS-like electrochemical process [J].

Snyder, GJ ;

Lim, JR ;

Huang, CK ;

Fleurial, JP .

NATURE MATERIALS, 2003, 2 (08) :528-531

[10] MEMS thermoelectric microcooler [J].

Yao, DJ ;

Kim, CJ ;

Chen, G ;

Liu, JL ;

Wang, KL ;

Snyder, J ;

Fleurial, JP .

TWENTIETH INTERNATIONAL CONFERENCE ON THERMOELECTRICS, PROCEEDINGS, 2001, :401-404

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