共 10 条
[1]
BAI JG, 2005, THESIS BLACKSBURG
[2]
Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2006, 29 (03)
:589-593
[3]
Curodeau A, 2000, J BIOMED MATER RES, V53, P525, DOI 10.1002/1097-4636(200009)53:5<525::AID-JBM12>3.0.CO
[4]
2-1
[6]
GERMAN RM, 1996, SINTERING THEORY PRA, pCH1
[9]
Mayo MJ, 1996, INT MATER REV, V41, P85, DOI 10.1179/095066096790326039
[10]
SACHS E, 1992, J ENG IND-T ASME, V114, P481