Fabrication of patterned gold microstructure by selective electroless plating

被引：22

作者：

Guan, F

Chen, MA ^{[1
]}

Yang, W

Wang, JQ

Yong, SR

Xue, QJ

机构：

[1] Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China

[2] NW Normal Univ, Coll Chem & Chem Engn, Lanzhou 730070, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2005年 / 240卷 / 1-4期

关键词：

patterned metal microstructure; electroless plating; microcontact printing;

D O I：

10.1016/j.apsusc.2004.06.050

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Patterned gold microstructures on glass or Si wafers have been fabricated by a novel method which is composed of selective electroless plating and microcontact printing. This process may be widely used for the production of fine metal patterns in printed circuits or as a substrate to form patterned SAMs. In addition, these patterned metal microstructures can be readily transferred to adhesive tape surface to fabricate flexible metal microstructure, which may be applied in all-plastic circuit. (C) 2004 Elsevier B.V. All rights reserved.

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收藏

页码：24 / 27

页数：4

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