The microstructures of the Sn-Zn-Al solder alloys

被引：78

作者：

Lin, KL ^{[1
]}

Wen, LH ^{[1
]}

Liu, TP ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1998年 / 27卷 / 03期

关键词：

cooling curve; differential scanning calorimetry; lead-free solder; microstructure;

D O I：

10.1007/s11664-998-0197-x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The microstructures of the Sn-Zn-Al lead-free solders have been investigated using scanning electron microscopy. The Al and Zn contents of the solders investigated were 0.45%similar to 4.5% and 8.55%similar to 85.5%, respectively. The solders were prepared from the Zn-5Al master alloy and Sn. The precipitates formed in these solders were analyzed for their compositions with energy dispersive spectroscopy. The eutectic temperature and the transition temperatures of these solders upon cooling were identified with cooling curves as well as with differential scanning calorimetry.

引用

页码：97 / 105

页数：9

共 18 条

[1]

BAKER H, 1979, METALS HDB, V2, P629

[2] THE PROPERTIES OF TIN-BISMUTH ALLOY SOLDERS [J].

FELTON, LE ;

RAEDER, CH ;

KNORR, DB .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1993, 45 (07) :28-32

[3] AN INVESTIGATION OF PHASE-EQUILIBRIA OF THE BI-SB-SN SYSTEM [J].

GHOSH, G ;

LOOMANS, M ;

FINE, ME .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :619-623

[4] MECHANICAL CHARACTERISTICS OF 96.5SN/3.5AG SOLDER IN MICROBONDING [J].

HARADA, M ;

SATOH, R .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04) :736-742

[5] ON THE SN-BI-AG TERNARY PHASE-DIAGRAM [J].

KATTNER, UR ;

BOETTINGER, WJ .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :603-610

[6]

Massalsky T.B., 1986, Binary Alloy Phase Diagrams, V1-3

[7] EQUILIBRIUM SOLIDIFICATION OF SN-AG-SB THERMAL FATIGUE-RESISTANT SOLDER ALLOYS [J].

MASSON, DB ;

KIRKPATRICK, BK .

JOURNAL OF ELECTRONIC MATERIALS, 1986, 15 (06) :349-353

[8] NEW PB-FREE SOLDER ALLOY WITH SUPERIOR MECHANICAL-PROPERTIES [J].

MCCORMACK, M ;

JIN, S ;

KAMMLOTT, GW ;

CHEN, HS .

APPLIED PHYSICS LETTERS, 1993, 63 (01) :15-17

[9] NEW, LEAD-FREE SOLDERS [J].

MCCORMACK, M ;

JIN, S .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :635-640

[10]

Mei Z., 1992, J ELECT MAT, V21

← 1 2 →