Design for manufacturability of SISE parallel plate forced convection heat sinks

被引：3

作者：

Iyengar, M ^{[1
]}

Bar-Cohen, A ^{[1
]}

机构：

[1] Univ Minnesota, Dept Mech Engn, Lab Thermal Management Elect, Minneapolis, MN 55455 USA

来源：

ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS | 2000年

关键词：

least-material; optimization; parametric; analytical; bonding; folding; modified die-casting; forging; skiving; machining;

D O I：

10.1109/ITHERM.2000.866820

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The development of cost/effective heat sinks for microelectronic applications involves the achievement of a subtle balance between the thermal design, for maximum heat rejection, and "design for manufacturability," for lowest material and manufacturing costs. The study reported herein extends a previously reported methodology to forced convection cooled rectangular plate heat sinks. Using a well validated analytical model, the thermofluid performance of the side-inlet-side-exit (SISE) hear sink has been characterized, parametric optimization carried out, and the maximum heat transfer capabilities for a range of operating points has been determined. A least-material optimization has been performed to achieve optimal material use. The analysis indicates the least-material design to provide significant mass savings for a model-ale penalty in thermal performance. Empirical criteria for manufacturability obtained from several heat sink manufacturers lead to qualitative guidelines.

引用

页码：141 / 148

页数：8

共 13 条

[1]

[Anonymous], HDB SINGLE PHASE CON

[2]

Bar-Cohen A., 1986, HEAT TRANSFER ENG, V6, P68

[3]

BARCOHEN A, 1998, P HEAT EXCH SUST DEV, P43

[4]

BENACHOUR MF, 1999, P ASME ADV EL PACK, V26, P737

[5]

GARNER SD, 1997, P ASME ADV EL PA EEP, V19, P1897

[6]

HOLAHAN MF, 1996, 1996 ASME HTD, V329, P63

[7]

IWASAKI H, 1994, P INT C THERM PHEN, P144

[8] Least-material optimization of vertical pin-fin, plate-fin, and triangular-fin heat sinks in natural convective heat transfer [J].

Iyengar, M ;

Bar-Cohen, A .

ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, :295-302

[9]

Kern D., 1972, EXTENDED SURFACE HEA

[10]

*NEW JERS ZINC CO, 1953, DIE CAST ENG

← 1 2 →