Microstructure and thermoelectric properties of p-type Bi0.5Sb0.5Te0.5 compounds fabricated by hot pressing and hot extrusion

被引：68

作者：

Seo, J ^{[1
]}

Park, K

Lee, D

Lee, C

机构：

[1] Inha Univ, Dept Met Engn, Inchon 402751, South Korea

[2] Chung Ju Natl Univ, Dept Mat Engn, Chungbuk 380702, South Korea

[3] Pohang Univ Sci & Technol, Ctr Adv Aerosp Mat, Pohang 790784, South Korea

来源：

关键词：

D O I：

10.1016/S1359-6462(97)00463-6

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

[No abstract available]

引用

页码：477 / 484

页数：8

共 6 条

FLEURIAL, JP ;

GAILLIARD, L ;

TRIBOULET, R ;

SCHERRER, H ;

SCHERRER, S .

[2]

Nishida I., 1988, THERMOELECTRIC SEMIC

[3] RECENT DEVELOPMENTS IN THERMOELECTRIC-MATERIALS [J].

ROWE, DM .

[4]

Weise J.R., 1960, J PHYS CHEM SOLIDS, V15, P13

[5]

WYCKOFF RWG, 1964, CRYSTAL STRUCTURE, V2

YIM, WM ;

ROSI, FD .