Microsample tensile testing of nanocrystalline copper

被引：229

作者：

Wang, YM

Wang, K

Pan, D

Lu, K

Hemker, KJ

Ma, E

机构：

[1] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA

[2] Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China

[3] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA

来源：

SCRIPTA MATERIALIA | 2003年 / 48卷 / 12期

基金：

美国国家科学基金会;

关键词：

nanocrystalline materials; strength; ductility; fracture; copper;

D O I：

10.1016/S1359-6462(03)00159-3

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The tensile properties of nanocrystalline copper with grain sizes <100 nm produced by surface mechanical attrition treatment have been characterized using a microsample testing technique. The nanocrystalline copper exhibits a yield strength as high as 760 MPa, with a small elongation to failure. Factors leading to the high strength and low ductility are discussed. (C) 2003 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.

引用

收藏

页码：1581 / 1586

页数：6

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